Concepedia

Jicheng Bai

JB

19

Publications

452

Citations

13

H-Index

2009

Active since

Affiliations

Harbin Institute of Technology(Current)

Tsinghua University

Shandong University of Technology

Heilongjiang Institute of Technology

Jicheng Bai is an author at Harbin Institute of Technology specializing in engineering, mechanical engineering, and microfabrication.

Top concepts

EngineeringMicrofabricationMechanical EngineeringElectrical EngineeringPulse PowerMicrostructure3D PrintingMicroelectronicsElectrical InsulationMicrofluidics

Publications per year

2009–2022

19

Publications

19

Fabrication of microelectrode with large aspect ratio and precision machining of micro-hole array by micro-EDM

Zhengkai Li, Jicheng Bai, Yan Cao et al. · Journal of Materials Processing Technology · 2019 · 61 citations

Engineering, Microfabrication, Mechanical Engineering +9

A novel micro-EDM method to improve microhole machining performances using ultrasonic circular vibration (UCV) electrode

Zhengkai Li, Jiajing Tang, Jicheng Bai · International Journal of Mechanical Sciences · 2020 · 60 citations

Engineering, Microfabrication, Material Machining +9

Micro-EDM method to fabricate three-dimensional surface textures used as SERS-active substrate

Zhengkai Li, Jicheng Bai, Jiajing Tang · Applied Surface Science · 2018 · 42 citations

Materials Science, Micro-edm Method, Engineering +9

Study of wire tension control system based on closed loop PID control in HS-WEDM

Qiang Li, Jicheng Bai, Yinsheng Fan et al. · The International Journal of Advanced Manufacturing Technology · 2015 · 35 citations

Electrical Engineering, Industrial Electronics, Engineering +5

Investigation on surface integrity in novel micro-EDM with two-dimensional ultrasonic circular vibration (UCV) electrode

Zhengkai Li, Jiajing Tang, Yusheng Li et al. · Journal of Manufacturing Processes · 2022 · 35 citations

Materials Science, Engineering, Microfabrication +8

Rows per page

1–5 of 19