YU Sheng-lin

Effect of alloying elements on properties and microstructures of SnAgCu solders

Lili Gao, Songbai Xue, Liang Zhang et al. · Microelectronic Engineering · 2010 · 160 citations

Natural Sciences, Materials Engineering, Materials Science +12

Development of Sn–Zn lead-free solders bearing alloying elements

Liang Zhang, Songbai Xue, Lili Gao et al. · Journal of Materials Science Materials in Electronics · 2009 · 132 citations

Natural Sciences, Materials Engineering, Materials Science +10

Effects of rare earth Ce on microstructures, solderability of Sn–Ag–Cu and Sn–Cu–Ni solders as well as mechanical properties of soldered joints

Jianxin Wang, Songbai Xue, YU Sheng-lin et al. · Journal of Alloys and Compounds · 2007 · 105 citations

Natural Sciences, Materials Engineering, Materials Science +13

Effects of rare earths on properties and microstructures of lead-free solder alloys

Liang Zhang, Songbai Xue, Lili Gao et al. · Journal of Materials Science Materials in Electronics · 2009 · 86 citations

Natural Sciences, Materials Engineering, Materials Science +12

Effects of trace amount addition of rare earth on properties and microstructure of Sn–Ag–Cu alloys

Liang Zhang, Songbai Xue, Lili Gao et al. · Journal of Materials Science Materials in Electronics · 2009 · 41 citations

Natural Sciences, Materials Engineering, Materials Science +14