Concepedia

Xiaoshuang Hui

XH

Statistics

Publications

3

Citations

35

H-Index

3

Active since

2023

Affiliations

Chinese Academy of Sciences(Current)

Institute of Electrical Engineering

University of Chinese Academy of Sciences

Tiangong University

Xiaoshuang Hui is an author at Chinese Academy of Sciences specializing in thermal resistance, power electronics, and packaging design.

ORCID

Publications per year

2023–2024

3

Publications

3

Review of Thermal Design of SiC Power Module for Motor Drive in Electrical Vehicle Application

Puqi Ning, Xiaoshuang Hui, D.Q. Li et al. · CES Transactions on Electrical Machines and Systems · 2024 · 13 citations · Full text

, , +17

Review of Hybrid Packaging Methods for Power Modules

Puqi Ning, Xiaoshuang Hui, Yuhui Kang et al. · Chinese Journal of Electrical Engineering · 2023 · 11 citations · Full text

, , +15

An Automatic Optimization Method for Electrical and Thermal Performance of Stacked DBC Power Module

Xiaoshuang Hui, Puqi Ning, Tao Fan et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2024 · 11 citations

, , +16

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