Concepedia

Wolfgang Schmitt

WS

6

Publications

135

Citations

6

H-Index

2010

Active since

Affiliations

Heraeus (Germany)(Current)

Wolfgang Schmitt is an author at Heraeus (Germany) specializing in electronic packaging, materials science, and materials engineering.

Top concepts

EngineeringMaterial ScienceElectronic PackagingMaterials EngineeringSinteringMicroelectronicsElectrical EngineeringMechanical EngineeringSolar PowerPower Devices

Publications per year

2010–2021

6

Publications

6

Silver Sinter Paste for SiC Bonding with Improved Mechanical Properties

Wolfgang Schmitt, Ly May Chew · 2017 · 34 citations

Materials Science, Materials Engineering, High Temperature Materials +15

Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment

Chin-Hao Tsai, Weichen Huang, Ly May Chew et al. · Journal of Materials Research and Technology · 2021 · 34 citations · Full text

A breakthrough in power electronics reliability &#x2014; New die attach and wire bonding materials

Thomas Krebs, Susanne Duch, Wolfgang Schmitt et al. · 2013 · 25 citations

Engineering, Power Devices, Power Electronics Reliability +22

Micro-Silver Sinter Paste Developed for Pressure Sintering on Bare Cu Surfaces under Air or Inert Atmosphere

Ly May Chew, Wolfgang Schmitt, Christian Schwarzer et al. · 2018 · 21 citations

Engineering, Mechanical Engineering, Powder Compaction +21

New silver contact pastes from high pressure sintering to low pressure sintering

Wolfgang Schmitt, W. C. Heraeus · 2010 · 11 citations

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