Solution-phase epitaxial growth of noble metal nanostructures on dispersible single-layer molybdenum disulfide nanosheets

Xiao Huang, Zhiyuan Zeng, Shuyu Bao, +4

Nature Communications

Materials ScienceNanocrystalline MaterialNanosheetEngineeringNanomaterials +7

Growth of noble metal nanoparticles on single-layer TiS₂and TaS₂nanosheets for hydrogen evolution reaction

Zhiyuan Zeng, Chaoliang Tan, Xiao Huang, +2

Energy & Environmental Science

EngineeringMetal NanoparticlesWater ElectrolyzersNanoheterogeneous CatalysisChemistry +16

MoS2 nanoflower-decorated reduced graphene oxide paper for high-performance hydrogen evolution reaction

Chong‐Bo Ma, Xiaoying Qi, Bo Chen, +7

Nanoscale

Germanium-on-silicon nitride waveguides for mid-infrared integrated photonics

Wei Li, P Chandrakasan Anantha, Shuyu Bao, +7

Applied Physics Letters

Optical MaterialsEngineeringIntegrated PhotonicsMid-infrared PhotonicsOptoelectronic Devices +20

High-efficiency normal-incidence vertical p-i-n photodetectors on a germanium-on-insulator platform

Yiding Lin, Kwang Hong Lee, Shuyu Bao, +4

Photonics Research

Wide-bandgap SemiconductorOptical MaterialsEngineeringOptoelectronic DevicesIntegrated Circuits +18

Reduction of threading dislocation density in Ge/Si using a heavily As-doped Ge seed layer

Kwang Hong Lee, Shuyu Bao, Bing Wang, +5

AIP Advances

EngineeringSilicon On InsulatorSemiconductorsGe Seed LayerMolecular Beam Epitaxy +14

Fabrication and characterization of germanium-on-insulator through epitaxy, bonding, and layer transfer

Kwang Hong Lee, Shuyu Bao, Gang Yih Chong, +3

Journal of Applied Physics

EngineeringOptoelectronic DevicesSilicon On InsulatorWafer Scale ProcessingMolecular Beam Epitaxy +16

Defects reduction of Ge epitaxial film in a germanium-on-insulator wafer by annealing in oxygen ambient

Kwang Hong Lee, Shuyu Bao, Gang Yih Chong, +3

APL Materials

EngineeringGe Epitaxial FilmOptoelectronic DevicesIntegrated CircuitsSilicon On Insulator +18

Integration of GaAs, GaN, and Si-CMOS on a common 200 mm Si substrate through multilayer transfer process

Kwang Hong Lee, Shuyu Bao, Li Zhang, +3

Applied Physics Express

EngineeringDevice IntegrationHandle WaferSemiconductor MaterialsIntegrated Circuits +18

GeSn-on-insulator substrate formed by direct wafer bonding

Dian Lei, Kwang Hong Lee, Shuyu Bao, +5

Applied Physics Letters

Materials EngineeringMaterials ScienceElectrical EngineeringWafer Scale ProcessingEngineering +11