Guangzhu Bai

Enhanced thermal conductivity in Cu/diamond composites by tailoring the thickness of interfacial TiC layer

Lühua Wang, Jianwei Li, M. Catalano et al. · Composites Part A Applied Science and Manufacturing · 2018 · 111 citations · Full text

Materials Engineering, Materials Science, Enhanced Thermal Conductivity +10

Tailoring interface structure and enhancing thermal conductivity of Cu/diamond composites by alloying boron to the Cu matrix

Guangzhu Bai, Lühua Wang, Yongjian Zhang et al. · Materials Characterization · 2019 · 108 citations

Materials Engineering, Materials Science, Diamond-like Carbon +7

High thermal conductivity of Cu-B/diamond composites prepared by gas pressure infiltration

Guangzhu Bai, Ning Li, Xitao Wang et al. · Journal of Alloys and Compounds · 2017 · 101 citations

Materials Science, Materials Engineering, High Thermal Conductivity +10

Interfacial structure evolution and thermal conductivity of Cu-Zr/diamond composites prepared by gas pressure infiltration

Lühua Wang, Jianwei Li, Guangzhu Bai et al. · Journal of Alloys and Compounds · 2018 · 83 citations

Materials Science, Diamond-like Carbon, Engineering +5

Precise control of versatile microstructure and properties of graphene aerogel <i>via</i> freezing manipulation

Xiangyu Zhu, Chao Yang, Pingwei Wu et al. · Nanoscale · 2020 · 60 citations

Materials Science, Graphene Nanomeshes, Ice Crystals +13