Statistics
Publications
2
Citations
72
H-Index
2
Active since
1998
Affiliations
N.R. Guydosh is an author at Harvard University Press specializing in wetting, flip-chip bonding, and packaging engineering.
Publications per year
1998–2002
2
2
Underflow process for direct-chip-attachment packaging
E. J. Cotts, T. Driscoll, N.R. Guydosh et al. · 2002 · 34 citations
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