Statistics
Publications
7
Citations
116
H-Index
7
Active since
2016
Affiliations
Dynex Semiconductor (United Kingdom)(Current)
Matthew Packwood is an author at Dynex Semiconductor (United Kingdom) specializing in power electronics, semiconductor devices, and engineering.
Publications per year
2016–2022
7
7
Mitigation of challenges in automotive power module packaging by dual sided cooling
Yangang Wang, Yun Li, Yibo Wu et al. · 2016 · 13 citations
Engineering, Automotive Engineering, Electrical Engineering +17
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