Concepedia

Chu-Chung Lee

CL

2

Publications

43

Citations

2

H-Index

2011

Active since

Chu-Chung Lee is an author specializing in electronic packaging, electrical engineering, and engineering.

Top concepts

EngineeringMaterial ScienceElectronic PackagingElectrical EngineeringCorrosionApplied PhysicsSurface ScienceMicroelectronicsChemical EngineeringMaterials Engineering

Publications per year

2011–2016

2

Publications

2

Copper wire bonding on low-k/copper wafers with Bond Over Active (BOA) structures for automotive customers

Tu Anh Tran, Chu-Chung Lee, Varughese Mathew et al. · 2011 · 23 citations

Materials Science, Electrical Engineering, Bond Over Active +12

Copper Ball Voids for Pd-Cu Wires: Affecting Factors and Methods of Controlling

Chu-Chung Lee, Varughese Mathew, Tu-Anh Tran et al. · 2016 · 20 citations

Materials Science, Materials Engineering, Electrical Engineering +13

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