Rongmei Niu

Thickness dependent critical strain in submicron Cu films adherent to polymer substrate

Rongmei Niu, Gang Liu, C. Wang et al. · Applied Physics Letters · 2007 · 113 citations

Electrical Resistance, Engineering, Severe Plastic Deformation +17

Power-system stabilizer (PSS) design by probabilistic sensitivity indexes (PSIs)

C. Y. Chung, K.W. Wang, C.T. Tse et al. · IEEE Transactions on Power Systems · 2002 · 69 citations

Engineering, Stabilization Technique, Eigenvalue Expectations +16

Simultaneously increasing strength and electrical conductivity in nanostructured Cu–Ag composite

Congcong Zhao, Xiaowei Zuo, Engang Wang et al. · Materials Science and Engineering A · 2015 · 69 citations

Materials Science, Electrical Engineering, Engineering +6

Microstructure and properties of nanostructured Cu28 wt%Ag microcomposite deformed after solidifying under a high magnetic field

Xiaowei Zuo, Ke Han, Congcong Zhao et al. · Materials Science and Engineering A · 2014 · 67 citations · Full text

Materials Science, Engineering, Nanomaterials +8

Microstructure and Strengthening Mechanism of Oxide Lanthanum Dispersion Strengthened Molybdenum Alloy

G.‐J. Zhang, Yujie Sun, Rongmei Niu et al. · Advanced Engineering Materials · 2004 · 50 citations

Materials Science, Materials Engineering, Molybdenum Alloy +8