Michael D. Glover

Wide Bandgap Technologies and Their Implications on Miniaturizing Power Electronic Systems

H. Alan Mantooth, Michael D. Glover, Paul Shepherd · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2014 · 261 citations

Engineering, Electrical Engineering, Materials Science +16

Nickel–Tin Transient Liquid Phase Bonding Toward High-Temperature Operational Power Electronics in Electrified Vehicles

Sang Won Yoon, Michael D. Glover, Koji Shiozaki · IEEE Transactions on Power Electronics · 2012 · 144 citations

Engineering, Materials Engineering, Materials Science +16

A Solution to Press-Pack Packaging of SiC MOSFETS

Nan Zhu, H. Alan Mantooth, Dehong Xu et al. · IEEE Transactions on Industrial Electronics · 2017 · 104 citations

Engineering, Electrical Engineering, Heat Transfer +16

3-D Wire Bondless Switching Cell Using Flip-Chip-Bonded Silicon Carbide Power Devices

Sayan Seal, Michael D. Glover, H. Alan Mantooth · IEEE Transactions on Power Electronics · 2017 · 74 citations

Engineering, Electrical Engineering, Materials Science +16

A wide bandgap silicon carbide (SiC) gate driver for high-temperature and high-voltage applications

Ranjan Lamichhane, Nance Ericsson, S.S. Frank et al. · 2014 · 61 citations

Engineering, Electrical Engineering, Materials Science +17