Christoph Steinbrüchel

Universal energy dependence of physical and ion-enhanced chemical etch yields at low ion energy

Christoph Steinbrüchel · Applied Physics Letters · 1989 · 283 citations

Engineering, Chemistry, Ion Process +18

A new method for analyzing Langmuir probe data and the determination of ion densities and etch yields in an etching plasma

Christoph Steinbrüchel · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1990 · 82 citations

Engineering, Plasma Science, Plasma Physics +17

Patterning of copper for multilevel metallization: reactive ion etching and chemical-mechanical polishing

Christoph Steinbrüchel · Applied Surface Science · 1995 · 38 citations

Materials Science, Materials Engineering, Chemical-mechanical Polishing +12

TiN, TaN and WxN as diffusion barriers for Cu on SiO2: capacitance–voltage, leakage current, and triangular-voltage-sweep tests after bias temperature stress

Christoph Steinbrüchel · Thin Solid Films · 2003 · 35 citations

Materials Engineering, Materials Science, Electrical Engineering +9

Nucleation and Growth of Electrochemically Deposited Copper on TiN and Copper from a Cu-NH[sub 3] Bath

Lyndon Wallace Graham, Christoph Steinbrüchel, David J. Duquette · Journal of The Electrochemical Society · 2002 · 33 citations

Materials Science, Materials Engineering, Chemical Engineering +15