Concepedia

Jangmuk Lim

JL

4

Publications

86

Citations

4

H-Index

2019

Active since

Affiliations

Hanyang University(Current)

Hyundai Mobis (South Korea)

Jangmuk Lim is an author at Hanyang University specializing in electronic packaging, microelectronics, and engineering.

Top concepts

EngineeringMicroelectronicsElectronic PackagingElectrical EngineeringHeat TransferRefrigerationThermodynamicsSolid MechanicsMaterial ScienceThermal Modeling

Publications per year

2019–2021

4

Publications

4

Finite Element and Experimental Analysis of Spacer Designs for Reducing the Thermomechanical Stress in Double-Sided Cooling Power Modules

Jae-Jin Jeon, Jihwan Seong, Jangmuk Lim et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2020 · 49 citations

Engineering, Liquid Metal Cooling, Mechanical Engineering +21

DBC-Packaged Inverter Power Module for Integrated Motor-Inverter Design Used in 48 V Mild Hybrid Starter-Generator (MHSG) System

Jihwan Seong, Se Min Park, Min Ki Kim et al. · IEEE Transactions on Vehicular Technology · 2019 · 15 citations

Electrical Engineering, Improved Package Design, Engineering +13

Multiphysics Simulation Analysis and Design of Integrated Inverter Power Module for Electric Compressor Used in 48-V Mild Hybrid Vehicles

Jihwan Seong, Sang Won Yoon, Se Min Park et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2019 · 11 citations

Design and Experimental Evaluation of Transfer-Molded 650 V Super-Junction mosfet Power Module for Industrial Applications

Jangmuk Lim, Jihwan Seong, Jae-Jin Jeon et al. · IEEE Transactions on Industry Applications · 2021 · 11 citations

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