Miyuki Harada

Enhanced partial discharge resistance of epoxy/clay nanocomposite prepared by newly developed organic modification and solubilization methods

Toshikatsu Tanaka, Yoshimichi Ohki, Mitsukazu Ochi et al. · IEEE Transactions on Dielectrics and Electrical Insulation · 2008 · 169 citations

Materials Science, Chemical Engineering, Partial Discharge +11

Thermal conductivity of liquid crystalline epoxy/BN filler composites having ordered network structure

Miyuki Harada, Nana Hamaura, Mitsukazu Ochi et al. · Composites Part B Engineering · 2013 · 136 citations

Materials Science, Engineering, Network Structure +6

Thermal‐conductivity properties of liquid‐crystalline epoxy resin cured under a magnetic field

Miyuki Harada, Mitsukazu Ochi, Masayuki Tobita et al. · Journal of Polymer Science Part B Polymer Physics · 2003 · 122 citations

Materials Science, Engineering, Liquid‐crystalline Epoxy Resin +10

Dielectric properties of epoxy/clay nanocomposites - effects of curing agent and clay dispersion method

Naoki Tagami, Masahide Okada, Naoshi Hirai et al. · IEEE Transactions on Dielectrics and Electrical Insulation · 2008 · 65 citations

Materials Science, Dielectric Properties, Chemical Engineering +11

Comparison of dielectric properties between epoxy composites with nanosized clay fillers modified by primary amine and tertiary amine

Naoki Tagami, Mayumi Hyuga, Yoshimichi Ohki et al. · IEEE Transactions on Dielectrics and Electrical Insulation · 2010 · 64 citations

Engineering, Primary Amine, Polymer Nanocomposites +16