Yasam Palguna - Concepedia

Author

Yasam Palguna

Indian Institute of Technology Hyderabad ORCID

Also Known As

PALGUNA YASAM, Palguna Yasam, Yasam Palguna

Publications

425

Citations

H-Index

Concepts

All Affiliations

Indian Institute of Technology Hyderabad National Institute of Technology Tiruchirappalli

About

Yasam Palguna is an author at Indian Institute of Technology Hyderabad specializing in engineering, materials science, and mechanical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	9	9	360
2	Biomedical Engineering	1	1	22
3	Chemical Engineering	1	1	61
4	Chemistry	1	1	61
5	Environmental Engineering	1	1	61

Yasam Palguna

Publications

360

Citations

H-Index

Page 1

	Year	Citations
Wire arc additive manufacturing of functionally graded material with SS 316L and IN625: Microstructural and mechanical perspectives R. Sasikumar, A. Rajesh Kannan, Subodh Kumar, CIRP journal of manufacturing science and technology Materials ScienceMaterials EngineeringSs 316LEngineeringPowder Metallurgy	2022	94
Process-microstructural features for tailoring fatigue strength of wire arc additive manufactured functionally graded material of SS904L and Hastelloy C-276 A. Rajesh Kannan, S. Mohan Kumar, N. Pravin Kumar, Materials Letters Materials ScienceProcess-microstructural FeaturesEngineeringWire ArcFatigue Strength	2020	77
Synthesis of titanium based hetero MOF photocatalyst for reduction of Cr (VI) from wastewater Egambaram Dhivya, Deviga Magadevan, Yasam Palguna, Journal of environmental chemical engineering Hetero Mof PhotocatalystChemical EngineeringEngineeringPhotoredox ProcessPhotochemistry	2019	61
Microstructure and mechanical properties of wire arc additive manufactured bi-metallic structure A. Rajesh Kannan, S. Mohan Kumar, R. Pramod, Science and Technology of Welding & Joining Materials ScienceMaterials EngineeringBi-metallic StructureEngineeringWire Arc	2020	46
Development of robust, ultra-smooth, flexible and transparent regenerated silk composite films for bio-integrated electronic device applications D V Santhosh Kumar Gunapu, Y. Bhavani Prasad, Sushma V. Mudigunda, International Journal of Biological Macromolecules Materials ScienceEngineeringFlexible ElectronicsPolymer ScienceWearable Electronics	2021	22
Hot tensile deformation and fracture behavior of wire arc additive manufactured Hastelloy C-276 A. Rajesh Kannan, Yasam Palguna, Rajesh Korla, Welding in the World Materials ScienceEngineeringPowder MetallurgyWire ArcMechanical Engineering	2023	18
High temperature deformation behavior of Al0.2CoCrFeNiMo0.5 high entropy alloy: Dynamic strain ageing Yasam Palguna, Kotla Sairam, Rajesh Korla Journal of Alloys and Compounds Materials ScienceMaterials EngineeringEngineeringSevere Plastic DeformationMechanical Engineering	2022	17
Effect of post weld heat treatment on the microstructure and mechanical properties of gas tungsten arc welded Al0.3CoCrFeNi high entropy alloy Yasam Palguna, Kotla Sairam, A. Rajesh Kannan, Scripta Materialia Materials ScienceMaterials EngineeringWelded JointFriction WeldingEngineering	2023	13
Microstructure and mechanical properties of wrought Al0.2CoCrFeNiMo0.5 high entropy alloy using gas tungsten arc welding process Yasam Palguna, A. Rajesh Kannan, Kotla Sairam, Materials Letters Materials ScienceMaterials EngineeringFriction WeldingEngineeringMechanical Properties	2022	12

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