Remigijus Jušk≐nas

Copper hydride formation in the electroless copper plating process: in situ X-ray diffraction evidence and electrochemical study

A. Vaškelis, Remigijus Jušk≐nas, J. Jačiauskien≐ · Electrochimica Acta · 1998 · 38 citations

Materials Science, Engineering, Electroless Copper +8

In situ X-ray diffraction investigation of nickel hydride formation during cathodic charging of Ni

Remigijus Jušk≐nas, Algirdas Selskis, Vil≐ Kadziauskien≐ · Electrochimica Acta · 1998 · 31 citations

Materials Science, Nickel Hydride Formation, Cathodic Charging +3

Voltammetric and structural characterization of sputter deposited Al–Mg films

Asta Grigucevičien≐, Konstantinas Leinartas, Remigijus Jušk≐nas et al. · Journal of Electroanalytical Chemistry · 2003 · 25 citations

Materials Science, Engineering, Al–mg Films +4

Current oscillations observed during codeposition of copper and tin from sulfate solutions containing Laprol 2402C

Arvydas Survila, Zenius Mockus, Remigijus Jušk≐nas · Electrochimica Acta · 1998 · 23 citations

Materials Science, Engineering, Corrosion +5

Magnetron-sputtered Al–Mg coatings – structural, microgravimetric and voltammetric characterisation in water, chloride and Cu(II) environment

Virginija Uksien≐, Konstantinas Leinartas, Remigijus Jušk≐nas et al. · Electrochemistry Communications · 2002 · 20 citations · Full text

Materials Science, Magnetism, Chemical Engineering +8