Concepedia

Author

Alexander Kolew

Karlsruhe Institute of Technology

Also Known As

A Kolew, A. Kolew, Alexander Kolew, Kolew A, Kolew, Alexander

37

Publications

506

Citations

13

H-Index

49

Concepts

All Affiliations

Karlsruhe Institute of TechnologyTechnical University of Denmark
AK

About

Alexander Kolew is an author at Karlsruhe Institute of Technology specializing in engineering, microfabrication, and materials science.

Top Concepts

#ConceptH-IndexPublicationsCitations

1

Engineering

11

12

343

2

Materials Science

10

10

248

3

Applied Physics

6

6

192

4

Biomedical Engineering

5

5

153

5

Mechanical Engineering

4

4

84

Alexander Kolew

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14

Publications

468

Citations

13

H-Index

YearCitations

3D high throughput screening and profiling of embryoid bodies in thermoformed microwell plates

Erik Vrij, Sara Espinoza, Markus Heilig,

Lab on a Chip

2016

78

Integration of organic semiconductor lasers and single-mode passive waveguides into a PMMA substrate

Christoph Vannahme, Sönke Klinkhammer, Alexander Kolew,

Microelectronic Engineering

2009

52

All-polymer organic semiconductor laser chips:
Parallel fabrication and encapsulation

Christoph Vannahme, Sönke Klinkhammer, Mads Brøkner Christiansen,

Optics Express

2010

47

Tunable Diffractive Optical Elements Based on Shape-Memory Polymers Fabricated via Hot Embossing

Senta Schauer, Tobias Meier, Maximilian Reinhard,

ACS Applied Materials & Interfaces

2016

46

Hot embossing of micro and sub-micro structured inserts for polymer replication

Alexander Kolew, Daniel Münch, Karsten Sikora,

Microsystem Technologies

2010

43

Hot embossing of high performance polymers

Matthias Worgull, Alexander Kolew, Markus Heilig,

Microsystem Technologies

2010

37

Liquid polystyrene: a room-temperature photocurable soft lithography compatible pour-and-cure-type polystyrene

Tobias M. Nargang, Lara Brockmann, Pavel M. Nikolov,

Lab on a Chip

2014

36

Hot pulling and embossing of hierarchical nano- and micro-structures

Michael Röhrig, Marc Schneider, Guénola Etienne,

Journal of Micromechanics and Microengineering

2013

29

Hot embossing and thermoforming of biodegradable three-dimensional wood structures

Matthias Worgull, Marc Schneider, Michael Röhrig,

RSC Advances

2013

24

Development and experimental validation of an analytical model to predict the demoulding force in hot embossing

Fatma Omar, Emmanuel Brousseau, Ahmed Elkaseer,

Journal of Micromechanics and Microengineering

2014

21

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