Renkuan Liu

Thermal Contact Resistance Optimization of Press-Pack IGBT Device Based on Liquid Metal Thermal Interface Material

Xiao Wang, Hui Li, Ran Yao et al. · IEEE Transactions on Power Electronics · 2021 · 46 citations

Engineering, Electrical Engineering, Materials Engineering +17

A Non-Destructive Testing Method for Fault Detection of Substation Grounding Grids

Xiujuan Wang, Zhihong Fu, Yao Wang et al. · Sensors · 2019 · 28 citations · Full text

Engineering, Electrical Engineering, Electromagnetics +15

Reactive-voltage coordinated control of offshore wind farm considering multiple optimization objectives

Hongtao Tan, Hui Li, Ran Yao et al. · International Journal of Electrical Power & Energy Systems · 2021 · 26 citations

Engineering, Marine Engineering, Offshore Engineering +13

A Thermal Twin Modeling Method of Press Pack IGBT Based on Power Loss

Hui Li, Bailing Zhou, Ran Yao et al. · IEEE Transactions on Electron Devices · 2022 · 21 citations

Engineering, Electrical Engineering, Mechanical Engineering +17

Optimization on Thermomechanical Behavior for Improving the Reliability of Press Pack IGBT Using Response Surface Method

Hui Li, Renze Yu, Ran Yao et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2021 · 20 citations

Engineering, Electrical Engineering, Materials Engineering +17