Concepedia

Dickson T. S. Yeung

DT

Statistics

Publications

2

Citations

68

H-Index

2

Active since

1999

Affiliations

University of Hong Kong(Current)

Hong Kong University of Science and Technology

Dickson T. S. Yeung is an author at University of Hong Kong specializing in mechanics of materials, solid mechanics, and engineering.

Top concepts

EngineeringSolid MechanicsMaterial ScienceElectronic PackagingMechanical EngineeringMechanics Of MaterialsPlasticity3D PrintingFood PackagingPolymer Science

Publications per year

1999–1999

2

Publications

2

Warpage of Plastic IC Packages as a Function of Processing Conditions

Dickson T. S. Yeung, M.M.F. Yuen · Journal of Electronic Packaging · 1999 · 46 citations

Food Packaging, Engineering, Mechanical Engineering +25

Specimen Design for Mixed Mode Interfacial Fracture Properties Measurement in Electronic Packages

Dickson T. S. Yeung, D.C.C. Lam, Matthew Ming Fai Yuen · Journal of Electronic Packaging · 1999 · 22 citations

Engineering, Stable Test Window, Mechanical Engineering +18

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