Concepedia

William C. Ballance

WC

4

Publications

91

Citations

4

H-Index

2018

Active since

Affiliations

University of Illinois Urbana-Champaign(Current)

Yonsei University

William C. Ballance is an author at University of Illinois Urbana-Champaign specializing in engineering, biomedical engineering, and nanomaterials.

Top concepts

EngineeringBiomedical EngineeringHydrogelsNanomaterialsNanotechnologyApplied PhysicsMaterial ScienceMicrofabricationFlexible ElectronicsSurface Modification

Publications per year

2018–2020

4

Publications

4

Electrothermal soft manipulator enabling safe transport and handling of thin cell/tissue sheets and bioelectronic devices

Byoung Soo Kim, Min Ku Kim, Younghak Cho et al. · Science Advances · 2020 · 36 citations · Full text

Transparent and Flexible Electronics Assembled with Metallic Nanowire-Layered Nondrying Glycerogel

Yongbeom Seo, Byoung Soo Kim, William C. Ballance et al. · ACS Applied Materials & Interfaces · 2020 · 26 citations

Materials Science, Engineering, Flexible Electronics +13

Stretchable, anti-bacterial hydrogel activated by large mechanical deformation

William C. Ballance, Yongbeom Seo, Kwang-Hyun Baek et al. · Journal of Controlled Release · 2018 · 18 citations

Biopolymer Gel, Hydrogels, Engineering +3

Preoperative vascular surgery model using a single polymer tough hydrogel with controllable elastic moduli

William C. Ballance, Vignesh Karthikeyan, Inkyu Oh et al. · Soft Matter · 2020 · 11 citations · Full text

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