T. F. Flavin is an author at IBM (United States) specializing in flexible electronics, electronic packaging, and mechanics of materials.
Top concepts
MechanicsPlasticityThin FilmsEngineeringMaterial ScienceMechanical BehaviorElectronic PackagingFlexible ElectronicsMechanical EngineeringMechanics Of Materials
Publications per year
1972–1972
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