Concepedia

Keh Shin Beh

KS

5

Publications

213

Citations

5

H-Index

2004

Active since

Affiliations

Intel (Malaysia)(Current)

Universiti Sains Malaysia

M S Ramaiah University of Applied Sciences

Keh Shin Beh is an author at Intel (Malaysia) specializing in materials science, mechanical engineering, and engineering.

Top concepts

EngineeringMaterial ScienceMechanical EngineeringPolymer SciencePolymer CompositesMechanics Of MaterialsPolymer ChemistryElectronic PackagingMechanical PropertiesPolymers

Publications per year

2004–2008

5

Publications

5

The properties of epoxy resin coated silica fillers composites

Pei Leng Teh, M. Mariatti, Hazizan Md Akil et al. · Materials Letters · 2006 · 87 citations

Materials Science, Composite Technology, Silica Fillers Composites +1

Thermal and mechanical properties of particulate fillers filled epoxy composites for electronic packaging application

Pei Leng Teh, Hazizan Md Akil, K.N. Seetharamu et al. · Polymers for Advanced Technologies · 2007 · 72 citations

Engineering, Mechanical Engineering, Thermoplastic Composite +16

Effect of curing agent on the properties of mineral silica filled epoxy composites

Pei Leng Teh, M. Mariatti, A.N.R. Wagiman et al. · Polymer Composites · 2007 · 26 citations

Reinforcement Material, Engineering, Mechanical Engineering +17

Effect of compression loads on the solder joint reliability of flip chip BGA packages

Luke J. Garner, C. Zhang, Keh Shin Beh et al. · 2004 · 16 citations

Engineering, Mechanical Engineering, Fixture Design +19

Effect of Ethanol as Diluent on the Properties of Mineral Silica Filled Epoxy Composites

Pei Leng Teh, M. Mariatti, Hazizan Md Akil et al. · Journal of Composite Materials · 2008 · 12 citations

Materials Science, Chemical Engineering, Engineering +12

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