Concepedia

Ching-Hsing Kao

CK

2

Publications

51

Citations

2

H-Index

2000

Active since

Affiliations

National Defense University(Current)

Ching-Hsing Kao is an author at National Defense University specializing in mechanics of materials, electronic packaging, and microfabrication.

Top concepts

SensorsEngineeringMaterial ScienceMicroelectronicsMicrofabricationElectronic PackagingMechanics Of MaterialsStructural Health MonitoringApplied PhysicsInstrumentation

Publications per year

2000–2002

2

Publications

2

In-Plane Packaging Stress Measurements Through Piezoresistive Sensors

Ben-Je Lwo, Tung‐Sheng Chen, Ching-Hsing Kao et al. · Journal of Electronic Packaging · 2002 · 27 citations

Engineering, Test Wafers, Mechanical Engineering +17

On the Study of Piezoresistive Stress Sensors for Microelectronic Packaging

Ben-Je Lwo, Ching-Hsing Kao, Tung‐Sheng Chen et al. · Journal of Electronic Packaging · 2000 · 24 citations

Engineering, Heat Source, Sensor Technology +16

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