Concepedia
1
Publications
25
Citations
H-Index
2019
Active since
Affiliations
Hanyang University(Current)
Dong-Woon Park is an author at Hanyang University specializing in electronic packaging, materials science, and 3d printing.
Top concepts
3D PrintingEngineeringApplied PhysicsMaterial ScienceElectronic Packaging
Publications per year
2019–2019
In-situ thickness measurement of epoxy molding compound in semiconductor package products using a Terahertz-Time of Flight System
Dong-Woon Park, Gyung-Hwan Oh, Dug-Joong Kim et al. · NDT & E International · 2019 · 25 citations
Materials Science, Semiconductor Package Products, Engineering +6
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