Danning Xie is an author at Flex (United States) specializing in engineering, electronic packaging, and mechanical engineering.
Top concepts
EngineeringElectronic PackagingAntennaHeat TransferThermodynamicsSolid MechanicsMicroelectronicsThermal ModelingThermal EngineeringComputer Engineering
Publications per year
2002–2024
3
3
Electrical and thermal modelling of QFN packages
A.C.W. Lu, Danning Xie, Zhan Shi et al. · 2002 · 26 citations
Engineering, Electromagnetic Compatibility, Rf Semiconductor +20
ReSym: Harnessing LLMs to Recover Variable and Data Structure Symbols from Stripped Binaries
Danning Xie, Zhuo Zhang, Nan Jiang et al. · 2024 · 19 citations · Full text
Investigation on PCB pad strength
Miao Cai, Danning Xie, Zheng Zhang et al. · 2010 · 10 citations
Rows per page
1–3 of 3