Statistics
Publications
2
Citations
26
H-Index
2
Active since
2002
Affiliations
Robin Gorrell is an author at W. L. Gore & Associates (United States) specializing in materials engineering, semiconductor devices, and electronic materials.
Publications per year
2002–2019
2
2
High density organic flip chip package substrate technology
W.G. Petefish, D.B. Noddin, D.A. Hanson et al. · 2002 · 14 citations
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