Statistics
Publications
1
Citations
10
H-Index
1
Active since
2020
Affiliations
Y. S. Wu is an author at Taiwan Semiconductor Manufacturing Company (Taiwan) specializing in packaging design, semiconductor reliability, and package-level reliability.
Publications per year
2020–2020
1
1
WLCSP Solder Ball Interconnection Enhancement for High Temperature Stress Reliability
C. C. Chen, K. H. Chen, Y. S. Wu et al. · 2020 · 10 citations
1–1 of 1