Statistics
Publications
1
Citations
27
H-Index
1
Active since
2002
S. Budiman is an author specializing in electronic packaging, mechanical engineering, and industrial engineering.
Publications per year
2002–2002
1
1
Understanding the process window for printing lead-free solder pastes
T.A. Nguty, S. Budiman, Robert L. Solomon et al. · 2002 · 27 citations
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