Statistics
Publications
1
Citations
10
H-Index
1
Active since
2004
T.Y. Lin is an author specializing in packaging design, adhesion strength, and delamination damage.
Publications per year
2004–2004
1
1
Failure analysis of full delamination on the stacked die leaded packages
T.Y. Lin, Z.P. Xiong, Y.E. Yao et al. · 2004 · 10 citations
1–1 of 1