Kuo-Tzu Peng

The influence of amorphous TaNx under-layer on the crystal growth of over-deposited Ta film

Weilin Wang, Wei‐Chun Chen, Kuo-Tzu Peng et al. · Thin Solid Films · 2016 · 15 citations

Materials Science, Engineering, Over-deposited Ta Film +6

The Reliability Improvement of Cu Interconnection by the Control of Crystallized α‐Ta/TaN_<i>x</i>  Diffusion Barrier

Weilin Wang, Chia‐Ti Wang, Wei‐Chun Chen et al. · Journal of Nanomaterials · 2015 · 13 citations · Full text

Materials Science, Electromigration Technique, Ta/tan Diffusion Barrier +15

The contact resistance reduction of Cu interconnects by optimizing the crystal behavior of Ta/TaN diffusion barrier

Weilin Wang, Kuo-Tzu Peng, Hsien-Chang Kuo et al. · Materials Science in Semiconductor Processing · 2014 · 10 citations

Materials Engineering, Materials Science, Electrical Engineering +12