Mengruo Wu

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Active since

2022

Affiliations

University of Science and Technology Beijing(Current)

Mengruo Wu is an author at University of Science and Technology Beijing specializing in silica gel treatment, paper surface treatment, and linear thermal expansion.

ORCID

Publications per year

2022–2024

Publications

A Quasi-Nondestructive Evaluation Method for Physical-Mechanical Properties of Fragile Archaeological Wood with TMA: A Case Study of an 800-Year-Old Shipwreck

Mengruo Wu, Xiangna Han, Zhenfang Qin et al. · Forests · 2022 · 27 citations · Full text

Humanities, Archaeology, Materials Science +16

Anti-Cracking TEOS-Based Hybrid Materials as Reinforcement Agents for Paper Relics

Mengruo Wu, Le Mu, Zhiyue Zhang et al. · Molecules · 2024 · 15 citations · Full text

Natural Sciences, Chemistry, Materials Engineering +14

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