Ronald W. Gedney

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Active since

1982

Affiliations

Hewlett-Packard (United States)(Current)

Ronald W. Gedney is an author at Hewlett-Packard (United States) specializing in materials engineering, electronic materials, and thermal cycling testing.

Publications per year

1982–2003

Publications

Cost/Performance Single-Chip Module

Diana Bendz, Ronald W. Gedney, J. Rasile · IBM Journal of Research and Development · 1982 · 30 citations

Engineering, Electrical Engineering, Materials Engineering +16

NEMI Lead-Free Assembly Project: Comparison Between PbSn and SnAgCu Reliability and Microstructures

Carol A. Handwerker, Elizabeth Benedetto, Edwin Bradley et al. · SMTA International · 2003 · 13 citations

Natural Sciences, Materials Engineering, Materials Science +16

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