Concepedia

W.M. Wang

WW

1

Publications

96

Citations

1

H-Index

1993

Active since

Affiliations

University of Nebraska–Lincoln(Current)

W.M. Wang is an author at University of Nebraska–Lincoln specializing in electronic packaging, computer engineering, and electromagnetic compatibility.

Top concepts

EngineeringHeat TransferThermodynamicsInstrumentationThermal ModelingThermal EngineeringComputer EngineeringElectronic PackagingElectrical InsulationElectrical Engineering

Publications per year

1993–1993

1

Publications

1

Thermal modeling and on-line monitoring of wire-EDM

K. P. Rajurkar, W.M. Wang · Journal of Materials Processing Technology · 1993 · 96 citations

Electrical Engineering, Engineering, Structural Health Monitoring +11

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