Chia-Ken Leong

Statistics

Publications

Citations

506

H-Index

Active since

2003

Affiliations

University at Buffalo, State University of New York(Current)

Chia-Ken Leong is an author at University at Buffalo, State University of New York specializing in materials science, materials engineering, and thermal properties of materials.

Publications per year

2003–2008

Publications

Carbon black dispersions as thermal pastes that surpass solder in providing high thermal contact conductance

Chia-Ken Leong, D.D.L. Chung · Carbon · 2003 · 137 citations

Engineering, Materials Engineering, Materials Science +17

Carbon black pastes as coatings for improving thermal gap-filling materials

Chia-Ken Leong, Yasuhiro Aoyagi, D.D.L. Chung · Carbon · 2005 · 77 citations

Engineering, Materials Engineering, Materials Science +14

Carbon black dispersions and carbon–silver combinations as thermal pastes that surpass commercial silver and ceramic pastes in providing high thermal contact conductance

Chia-Ken Leong, D.D.L. Chung · Carbon · 2004 · 57 citations

Engineering, Materials Engineering, Materials Science +17

Carbon Nanotube Thermal Pastes for Improving Thermal Contacts

Yunsheng Xu, Chia-Ken Leong, D.D.L. Chung · Journal of Electronic Materials · 2007 · 50 citations

Natural Sciences, Materials Engineering, Materials Science +14

Comparative evaluation of thermal interface materials for improving the thermal contact between an operating computer microprocessor and its heat sink

Timothy A. Howe, Chia-Ken Leong, D.D.L. Chung · Journal of Electronic Materials · 2006 · 37 citations

Engineering, Computer Engineering, Materials Science +17

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