Concepedia
1
Publications
82
Citations
H-Index
2007
Active since
Affiliations
Huafan University(Current)
Yi-Peng Lai is an author at Huafan University specializing in engineering, electronic packaging, and electrical engineering.
Top concepts
EngineeringMicroelectronicsElectronic PackagingElectrical Engineering
Publications per year
2007–2007
Surface quality improvement of wire-EDM using a fine-finish power supply
Mu‐Tian Yan, Yi-Peng Lai · International Journal of Machine Tools and Manufacture · 2007 · 82 citations
Electrical Engineering, Engineering, Surface Finish +4
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