Concepedia

Juan Téllez

JT

4

Publications

112

Citations

4

H-Index

2011

Active since

Affiliations

Simon Fraser University(Current)

Juan Téllez is an author at Simon Fraser University specializing in engineering, mechanical engineering, and adhesive materials.

Top concepts

EngineeringMechanical EngineeringMaterial ScienceAdhesive MaterialsRoboticsChemistrySoft RoboticsBiofabricationPolymer ScienceMicrofabrication

Publications per year

2011–2018

4

Publications

4

Characterization of electro-adhesives for robotic applications

Juan Téllez, Jeff Krahn, Carlo Menon · 2011 · 41 citations

Materials Science, Electroactive Material, Engineering +10

Towards the use of mushroom-capped dry adhesives in outer space: Effects of low pressure and temperature on adhesion strength

Michael Henrey, Juan Téllez, Kjetil Wormnes et al. · Aerospace Science and Technology · 2013 · 37 citations

Outer Space, Mushroom-capped Dry Adhesives, Engineering +5

Nonangled anisotropic elastomeric dry adhesives with tailorable normal adhesion strength and high directionality

Dan Sameoto, Helia Sharif, Juan Téllez et al. · Journal of Adhesion Science and Technology · 2012 · 22 citations

Materials Science, Dry Adhesives, Fiber Cap +15

En Route to Chiral-at-Metal Ruthenium Complexes Containing Tripodal Tetradentate Ligands

Juan Téllez, Isabel Méndez, Fernando Viguri et al. · Organometallics · 2018 · 12 citations · Full text

Inorganic Chemistry, Tetradentate Ligands, Engineering +10

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