Gil Seop Kim

Fabrication of a Cu‐Cone‐Shaped Cation Source Inserted Conductive Bridge Random Access Memory and Its Improved Switching Reliability

Hae Jin Kim, Tae Hyung Park, Kyung Jean Yoon et al. · Advanced Functional Materials · 2019 · 71 citations

Materials Science, Improved Switching Reliability, Electrical Engineering +15

Defect-Engineered Electroforming-Free Analog HfO_<i>x</i> Memristor and Its Application to the Neural Network

Gil Seop Kim, Hanchan Song, Ji Hun Kim et al. · ACS Applied Materials & Interfaces · 2019 · 57 citations

Balancing the Source and Sink of Oxygen Vacancies for the Resistive Switching Memory

Tae Hyung Park, Young Jae Kwon, Hae Jin Kim et al. · ACS Applied Materials & Interfaces · 2018 · 31 citations

Investigation of the retention performance of an ultra-thin HfO2 resistance switching layer in an integrated memory device

Gil Seop Kim, Tae Hyung Park, Hae Jin Kim et al. · Journal of Applied Physics · 2018 · 27 citations

Oxygen Vacancy, Electrical Engineering, Non-volatile Memory +14

Electroforming-Free Bipolar Resistive Switching in GeSe Thin Films with a Ti-Containing Electrode

Woohyun Kim, Chanyoung Yoo, Eui-Sang Park et al. · ACS Applied Materials & Interfaces · 2019 · 19 citations