Ran Jiang

Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

John H. Lau, Ming Li, Dewen Tian et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2017 · 147 citations

Electrical Engineering, Chip-scale Package, Engineering +15

MOFs meet electrospinning: New opportunities for water treatment

Rongfu Peng, Shuai Zhang, Yiyuan Yao et al. · Chemical Engineering Journal · 2022 · 118 citations

Nanofiber, Chemical Engineering, Engineering +3

Low voltage operation of IGZO thin film transistors enabled by ultrathin Al2O3 gate dielectric

Pengfei Ma, Lulu Du, Yiming Wang et al. · Applied Physics Letters · 2018 · 114 citations · Full text

Materials Science, Semiconductors, Electrical Engineering +15

Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging

John H. Lau, Ming Li, Qingqian Margie Li et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 91 citations

Advanced Packaging, Electrical Engineering, Chip-scale Package +15

Fan-Out Wafer-Level Packaging for Heterogeneous Integration

John H. Lau, Ming Li, Margie Li Qingqian et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 83 citations

3D Ic Architecture, Electrical Engineering, New Assembly Process +15