Mirosław J. Kruszewski

Diamond–tungsten based coating–copper composites with high thermal conductivity produced by Pulse Plasma Sintering

Andrey M. Abyzov, Mirosław J. Kruszewski, Ł. Ciupiński et al. · Materials & Design (1980-2015) · 2015 · 148 citations

Natural Sciences, Materials Engineering, Materials Science +17

Design of interfacial Cr3C2 carbide layer via optimization of sintering parameters used to fabricate copper/diamond composites for thermal management applications

Ł. Ciupiński, Mirosław J. Kruszewski, Justyna Grzonka et al. · Materials & Design · 2017 · 137 citations

Engineering, Materials Engineering, Materials Science +13

Interfacial microstructure of copper/diamond composites fabricated via a powder metallurgical route

Justyna Grzonka, Mirosław J. Kruszewski, M. Rosiński et al. · Materials Characterization · 2014 · 75 citations

Natural Sciences, Materials Engineering, Materials Science +16

Thermal conductivity enhancement of copper–diamond composites by sintering with chromium additive

Patrycjusz Mańkowski, Adam Dominiak, Roman Domański et al. · Journal of Thermal Analysis and Calorimetry · 2014 · 62 citations · Full text

Engineering, Materials Engineering, Materials Science +16

Thermoelectric properties of Cu2S obtained by high temperature synthesis and sintered by IHP method

Paweł Nieroda, Juliusz Leszczyński, Andrzej Mikuła et al. · Ceramics International · 2020 · 41 citations

Natural Sciences, Materials Engineering, Materials Science +14