Concepedia

Chun Pei

CP

2

Publications

47

Citations

2

H-Index

2017

Active since

Affiliations

The University of Osaka(Current)

Chun Pei is an author at The University of Osaka specializing in electronic packaging, materials engineering, and materials science.

Top concepts

EngineeringMaterial ScienceElectronic PackagingMaterials EngineeringCorrosionSinteringHeat TransferMicrostructureApplied PhysicsSolid Mechanics

Publications per year

2017–2019

2

Publications

2

Thermal Stability of Silver Paste Sintering on Coated Copper and Aluminum Substrates

Chun Pei, Chuantong Chen, Katsuaki Suganuma et al. · Journal of Electronic Materials · 2017 · 28 citations

Materials Engineering, Materials Science, Coated Copper +10

Thermal shock reliability of a GaN die-attach module on DBA substrate with Ti/Ag metallization by using micron/submicron Ag sinter paste

Dongjin Kim, Chuantong Chen, Chun Pei et al. · Japanese Journal of Applied Physics · 2019 · 19 citations · Full text

Aluminium Nitride, Engineering, Thermal Shock Damage +23

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