H. Ohsuga is an author at Sumitomo Bakelite (Japan) specializing in 3d printing, electronic packaging, and high temperature materials.
Top concepts
3D PrintingEngineeringMaterial ScienceElectronic PackagingMechanical EngineeringHigh Temperature Materials
Publications per year
2002–2002
1
1
Development of molding compounds suited for copper leadframes
H. Ohsuga, Hiroshi Suzuki, Takashi Aihara et al. · 2002 · 29 citations
Materials Science, Engineering, High Temperature Materials +11
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