Sai K. Mylavarapu

Fabrication and design aspects of high-temperature compact diffusion bonded heat exchangers

Sai K. Mylavarapu, Xiaodong Sun, Richard N. Christensen et al. · Nuclear Engineering and Design · 2011 · 140 citations

Engineering, Materials Science, Mechanical Engineering +14

Thermal hydraulic performance testing of printed circuit heat exchangers in a high-temperature helium test facility

Sai K. Mylavarapu, Xiaodong Sun, Richard E. Glosup et al. · Applied Thermal Engineering · 2014 · 103 citations · Full text

Engineering, Mechanical Engineering, Heat Transfer +15

Numerical study on thermal hydraulic performance of a Printed Circuit Heat Exchanger

Justin Figley, Xiaodong Sun, Sai K. Mylavarapu et al. · Progress in Nuclear Energy · 2013 · 89 citations

Engineering, Computational Engineering, Mechanical Engineering +16

Investigation of High-Temperature Printed Circuit Heat Exchangers for Very High Temperature Reactors

Sai K. Mylavarapu, Xiaodong Sun, Justin Figley et al. · Journal of Engineering for Gas Turbines and Power · 2009 · 62 citations

Engineering, Materials Engineering, Materials Science +17

Design, Fabrication, Performance Testing, and Modeling of Diffusion Bonded Compact Heat Exchangers in a High-Temperature Helium Test Facility

Sai K. Mylavarapu · OhioLink ETD Center (Ohio Library and Information Network) · 2011 · 19 citations · Full text

Engineering, Materials Science, Mechanical Engineering +17