Concepedia

Kun‐An Chiu

KC

8

Publications

325

Citations

8

H-Index

1974

Active since

Affiliations

Northrop Grumman (United States)(Current)

National Yang Ming Chiao Tung University

Kun‐An Chiu is an author at Northrop Grumman (United States) specializing in engineering, applied physics, and electrical engineering.

Top concepts

EngineeringApplied PhysicsMaterial ScienceElectrical EngineeringPhysicsSemiconductorsMaterials EngineeringThin FilmsCharge TransportCrystalline Defects

Publications per year

1974–2022

8

Publications

8

Hole and electron transport in SiO2 films

O. L. Curtis, J. R. Srour, Kun‐An Chiu · Journal of Applied Physics · 1974 · 110 citations

Engineering, Semiconductor Materials, Pulsed Electron Beam +16

Charge transport studies in SiO<sub>2</sub>: Processing effects and implications for radiation hardening

J. R. Srour, O. L. Curtis, Kun‐An Chiu · IEEE Transactions on Nuclear Science · 1974 · 66 citations

Charge Transport Studies, Electrical Engineering, Radiation Hardening +12

Radiation-Induced Charge Transport and Charge Buildup in SiO2 Films at Low Temperatures

J. R. Srour, S. Othmer, O. L. Curtis et al. · IEEE Transactions on Nuclear Science · 1976 · 59 citations

Semiconductors, Engineering, Physics +14

MOS Hardening Approaches for Low-Temperature Applications

J. R. Srour, Kun‐An Chiu · IEEE Transactions on Nuclear Science · 1977 · 35 citations

Materials Science, Materials Engineering, Electrical Engineering +13

Diisopropylantimonyhydride (DIPSbH) for low temperature epitaxial growth of InSb

Jeong‐Hun Shin, Kun‐An Chiu, G. B. Stringfellow et al. · Journal of Crystal Growth · 1993 · 21 citations

Materials Science, Materials Engineering, Engineering +6

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