Peisheng Liu

Heat Dissipation Characteristics of IGBT Module Based on Flow-Solid Coupling

Lipeng Tan, Peisheng Liu, Chenhui She et al. · Micromachines · 2022 · 34 citations · Full text

Engineering, Automotive Engineering, Electrical Engineering +17

Research on Heat Dissipation of Multi-Chip LED Filament Package

Lipeng Tan, Peisheng Liu, Chenhui She et al. · Micromachines · 2021 · 16 citations · Full text

Engineering, Electrical Engineering, Materials Science +17

Effect of Solder Layer Void Damage on the Temperature of IGBT Modules

Pengpeng Xu, Peisheng Liu, Lei Yan et al. · Micromachines · 2023 · 15 citations · Full text

Engineering, Electrical Engineering, Materials Science +17

Reliability Analysis of Flip-Chip Packaging GaN Chip with Nano-Silver Solder BUMP

Lei Yan, Peisheng Liu, Pengpeng Xu et al. · Micromachines · 2023 · 14 citations · Full text

Engineering, Electrical Engineering, Materials Engineering +17

3D package thermal analysis and thermal optimization

Yaohui Deng, Peisheng Liu, Zhao Zhang et al. · Case Studies in Thermal Engineering · 2024 · 12 citations · Full text

Engineering, Materials Engineering, Materials Science +16