Concepedia

Kun-Cheng Peng

KP

Statistics

Publications

3

Citations

57

H-Index

3

Active since

2000

Affiliations

Ming Chi University of Technology(Current)

Dayeh University

Kun-Cheng Peng is an author at Ming Chi University of Technology specializing in applied physics, chemical engineering, and engineering.

Top concepts

Publications per year

2000–2014

3

Publications

3

Influence of annealing on microstructural and photoelectrochemical characteristics of CuSCN thin films via electrochemical process

Mao‐Chia Huang, TsingHai Wang, Yao-Tien Tseng et al. · Journal of Alloys and Compounds · 2014 · 24 citations

, , +9

Effect of Bath Temperature on Microstructure of Sulfamate Nickel Electrodeposits

Chao-Sung Lin, Kun-Cheng Peng, Pei‐Cheng Hsu et al. · Materials Transactions JIM · 2000 · 20 citations · Full text

, , +18

Annealing Behavior of Nickel Electrodeposited from Sulfamate Bath at Different Temperatures

Chao-Sung Lin, Pei‐Cheng Hsu, Kun-Cheng Peng et al. · MATERIALS TRANSACTIONS · 2001 · 13 citations · Full text

, , +22

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