Yong‐Seog Kim

Thermally conductive EMC (epoxy molding compound) for microelectronic encapsulation

Wonho Kim, Jong‐Woo Bae, Ildong Choi et al. · Polymer Engineering and Science · 1999 · 93 citations

Engineering, Epoxy Matrix, Thermal Conductivity +16

Self‐Propagating High‐Temperature Synthesis of Aluminum Nitride under Lower Nitrogen Pressures

Jason Shin, Do‐Hwan Ahn, Mee‐Shik Shin et al. · Journal of the American Ceramic Society · 2000 · 50 citations

Materials Science, Materials Engineering, Chemical Engineering +13

Physical Properties of Barrier Ribs of Plasma Display Panels: I, Formation of Pores during Sintering of Lead Borosilicate Glass Frits

Geon‐Ho Hwang, Hyung‐Jo Jeon, Yong‐Seog Kim · Journal of the American Ceramic Society · 2002 · 34 citations

Materials Engineering, Materials Science, Chemical Engineering +15

Aluminum Nitride Whisker Formation during Combustion Synthesis

K.Y. Lee, Do‐Hwan Ahn, Yong‐Seog Kim · Journal of the American Ceramic Society · 2000 · 32 citations

Materials Science, Aluminium Nitride, Chemical Engineering +13

Physical Properties of Barrier Ribs of Plasma Display Panels: II, Effects of Fillers

Geon‐Ho Hwang, Won‐Yong Kim, Hyung‐Jo Jeon et al. · Journal of the American Ceramic Society · 2002 · 29 citations

Materials Science, Materials Engineering, Glass-ceramic +14