Seung Kun Lee

Contact Damage Accumulation in Tic ₃ SiC ₂

I.M. Low, Seung Kun Lee, Brian R. Lawn et al. · Journal of the American Ceramic Society · 1998 · 158 citations

Natural Sciences, Materials Engineering, Materials Science +17

Effects of α‐Sic versus β‐Sic Starting Powders on Microstructure and Fracture Toughness of Sic Sintered with Al ₂ O ₃ ‐Y ₂ O ₃ Additives

Seung Kun Lee, Chong Hee Kim · Journal of the American Ceramic Society · 1994 · 134 citations

Natural Sciences, Materials Engineering, Materials Science +17

Role of Microstructure in Hertzian Contact Damage in Silicon Nitride: I, Mechanical Characterization

Seung Kun Lee, Sataporn Wuttiphan, Brian R. Lawn · Journal of the American Ceramic Society · 1997 · 106 citations

Natural Sciences, Materials Engineering, Materials Science +17

Microstructural development and mechanical properties of pressureless-sintered SiC with plate-like grains using Al2O3-Y2O3 additives

Seung Kun Lee, Yoon Chang Kim, Chong Hee Kim · Journal of Materials Science · 1994 · 87 citations

Engineering, Materials Engineering, Materials Science +17

Contact‐Induced Transverse Fractures in Brittle Layers on Soft Substrates: A Study on Silicon Nitride Bilayers

Kee Sung Lee, Sataporn Wuttiphan, Xiaozhi Hu et al. · Journal of the American Ceramic Society · 1998 · 82 citations

Engineering, Materials Engineering, Materials Science +17