Binli Liu

Lifting-Off of Al Bonding Wires in IGBT Modules Under Power Cycling: Failure Mechanism and Lifetime Model

Yongle Huang, Yingjie Jia, Yifei Luo et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2019 · 94 citations

Engineering, Al Bonding Wires, Igbt Modules +19

Failure Mechanism of Die-Attach Solder Joints in IGBT Modules Under Pulse High-Current Power Cycling

Yongle Huang, Yifei Luo, Fei Xiao et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2018 · 69 citations

Engineering, Die-attach Solder, Igbt Modules +16

PSpice-COMSOL-Based 3-D Electrothermal–Mechanical Modeling of IGBT Power Module

Yingjie Jia, Fei Xiao, Yaoqiang Duan et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2019 · 61 citations

Device Modeling, Electrical Engineering, Engineering +14

Fatigue Mechanism of Die-Attach Joints in IGBTs Under Low-Amplitude Temperature Swings Based on 3D Electro-Thermal-Mechanical FE Simulations

Yongle Huang, Hongfei Deng, Yifei Luo et al. · IEEE Transactions on Industrial Electronics · 2020 · 45 citations

Engineering, Mechanical Engineering, Reliability Engineering +20

Physics of failure of die-attach joints in IGBTs under accelerated aging: Evolution of micro-defects in lead-free solder alloys

Yongle Huang, Yifei Luo, Fei Xiao et al. · Microelectronics Reliability · 2020 · 42 citations

Materials Science, Engineering, Hardware Reliability +10