Guillaume Moritz

IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management

Pascal Vivet, Èric Guthmuller, Yvain Thonnart et al. · IEEE Journal of Solid-State Circuits · 2020 · 124 citations · Full text

Engineering, Computer Engineering, High-performance Computing +17

2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm² Inter-Chiplet Interconnects and 156mW/mm²@ 82%-Peak-Efficiency DC-DC Converters

Pascal Vivet, Èric Guthmuller, Yvain Thonnart et al. · 2020 · 60 citations

Engineering, Computer Engineering, High-performance Computing +17

A 32 kb 0.35–1.2 V, 50 MHz–2.5 GHz Bit-Interleaved SRAM With 8 T SRAM Cell and Data Dependent Write Assist in 28-nm UTBB-FDSOI CMOS

Anuj Grover, G. S. Visweswaran, Chittoor R. Parthasarathy et al. · IEEE Transactions on Circuits and Systems I Regular Papers · 2017 · 16 citations

Engineering, Computer Engineering, Electrical Engineering +15

Very High Brightness, High Resolution CMOS Driving Circuit for Microdisplay in Augmented Reality

Margaux Vigier, Thomas Pilloix, Bertrand Dupont et al. · 2020 · 13 citations · Full text

Engineering, Electrical Engineering, Microelectronics +12

A 3.0μW@5fps QQVGA Self-Controlled Wake-Up Imager with On-Chip Motion Detection, Auto-Exposure and Object Recognition

Arnaud Verdant, William Guicquéro, Nicolas Royer et al. · 2020 · 10 citations

Engineering, Computer Engineering, Computer Science +17