Sebastian Weis

TERAFLUX: Harnessing dataflow in next generation teradevices

Roberto Giorgi, Rosa M. Badía, François Bodin et al. · Microprocessors and Microsystems · 2014 · 66 citations

Computing, Computer Science, Computer Systems +13

Thermal Transport Properties of Functionally Graded Carbon Aerogels

F. Hemberger, Sebastian Weis, Gudrun Reichenauer et al. · International Journal of Thermophysics · 2009 · 57 citations · Full text

Engineering, Materials Engineering, Materials Science +13

The TERAFLUX Project: Exploiting the DataFlow Paradigm in Next Generation Teradevices

Marco Solinas, Rosa M. Badía, François Bodin et al. · 2013 · 32 citations

Engineering, Computer Engineering, Computer Science +10

Low temperature joining of copper by Ag nanopaste: correlation of mechanical properties and process parameters

Susann Hausner, Sebastian Weis, B. Wielage et al. · Welding in the World · 2016 · 27 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Architectural Support for Fault Tolerance in a Teradevice Dataflow System

Sebastian Weis, Arne Garbade, Bernhard Fechner et al. · International Journal of Parallel Programming · 2014 · 26 citations

Engineering, Computer Engineering, Computer Science +16